| 项次/Item | 项目/Project | 能力/Capability | |
|---|---|---|---|
| 1 | PCB层数Minimum/Maximum Layer number | 1/2 Layers | |
| 2 | CCL板材种类 | FR4/CEM1/FR1/铝基板 | |
| 3 | 最小成板厚Minimum Board thickness | 0.2mm(1LAYERS) 0.4mm(2LAYERS) | |
| 4 | 最小线宽/线距Minimum Line Width/Space | 4mil / 4mil | |
| 5 | 最小孔径Minimum Drill hole size | 8 mil | |
| 6 | 镀通孔PTH 纵横比Aspect Ratio | 8 | |
| 7 | 镀通孔PTH 孔铜厚度Hole copper thickness | ≧0.8mil | |
| 8 | 最大成品尺寸Maximum Board size | 450 X 600 mm | |
| 9 | 最大成品板厚Maximum Board thickness | 2.0mm | |
| 10 | 防焊对准误差Solder Mask Registration | ±4 mil | |
| 11 | 成品孔径误差Hole Size Tolerance | ±2 mil | |
| 12 | 定位点误差Fiducial Mark Tolerance | ±4 mil | |
| 13 | 成品板平整度Board Flatness Tolerance | 板厚≧1.2→以1个板厚,板厚≦1.2→以1.2mm | |
| 14 | 断/短路测试条件Open/Short Test | 开路阻抗:20Ω~100KΩ 绝缘阻抗:100KΩ~20MΩ | |
