| 項次/Item | 項目/Project | 能力/Capability | |
|---|---|---|---|
| 1 | PCB層數 Minimum/Maximum Layer number | 1/2 Layers | |
| 2 | CCL板材種類 | FR4/CEM1/FR1/鋁基板 | |
| 3 | 最小成板厚 Minimum Board thickness | 0.2mm(1LAYERS) 0.4mm(2LAYERS) | |
| 4 | 最小線寬/線距 Minimum Line Width/Space | 4mil / 4mil | |
| 5 | 最小孔徑 Minimum Drill hole size | 8 mil | |
| 6 | 鍍通孔PTH 縱橫比 Aspect Ratio | 8 | |
| 7 | 鍍通孔PTH 孔銅厚度Hole copper thickness | ≧0.8mil | |
| 8 | 最大成品尺寸Maximum Board size | 450 X 600 mm | |
| 9 | 最大成品板厚Maximum Board thickness | 2.0mm | |
| 10 | 防焊對準誤差Solder Mask Registration | ±4 mil | |
| 11 | 成品孔徑誤差Hole Size Tolerance | ±2 mil | |
| 12 | 定位點誤差Fiducial Mark Tolerance | ±4 mil | |
| 13 | 成品板平整度Board Flatness Tolerance | 板厚≧1.2→以1個板厚,板厚≦1.2→以1.2mm | |
| 14 | 斷/短路測試條件 Open/Short Test | 開路阻抗:20Ω~100KΩ 絕緣阻抗:100KΩ~20MΩ | |
